The Energy Stamp Alliance (PSA) has posted some particulars on Intel’s upcoming high-performance, 10 nm structure. Code-named Ice Lake, the Xeon components of this design will apparently usher in one more new socket (socket LGA 4189, in comparison with the socket LGA 3647 resolution for Kaby lake and upcoming Cascade Lake designs). TDP is being proven as elevated with Intel’s Ice Lake designs, with an “as much as” 230 W TDp – greater than the Skylake or Cascade Lake-based platforms, which simply screams at increased core counts (and different features equivalent to OmniPath or on-package FPGAs).
Digging a bit of deeper into the documentation launched by the PSA exhibits Intel’s Ice Lake natively supporting 8-channel memory as properly, which is smart, contemplating the rising wants in each obtainable memory capability, and precise throughput, that simply retains rising. Greater than an fascinating, sudden growth, it is a signal of the instances.
Bel Power Solutions, Power Stamp Alliance, via AnandTech
Source : TechPowerUp