In associated news, the corporate is giving ending touches to a new 8-core “Espresso Lake” die for the mainstream-desktop platform (LGA1151 socket, 300-series chipset). This die features 8 cores, and doubtless 16 MB of shared L3 cache, whereas retaining the iGPU and uncore parts from the prevailing Espresso Lake-S die. The chip might retain the traditional “Ring Bus” design. The new 8-core mainstream-desktop SKUs, and at the least two new high-end desktop SKUs (20-core and 22-core), could possibly be launched in September 2018. The “Basin Falls” refresh, coupled with the new LGA3647 “Purley” spinoff for the 28-core monstrosity, will probably be all Intel has to face AMD this 12 months, with the corporate’s subsequent HEDT silicon, “Cascade Lake-X” being reportedly delayed to the second half of 2019, in all probability as a consequence of foundry issues.
Source : TechPowerUp